Product overview
- Part Number
- SP800-0.005-00-44
- Manufacturer
- Bergquist Company
- Product Category
- Thermal Interface Products
- Description
- Thermal Interface Products Sil-Pad, 0.005 Inch Thick, Sil-Pad TSP 1600/Sil-Pad 800
Documents & Media
- Datasheets
- SP800-0.005-00-44
Product Attributes
- Breakdown Voltage :
- 3 kVAC
- Color :
- Gold
- Flammability Rating :
- UL 94 V-0
- Material :
- Silicone Elastomer
- Maximum Operating Temperature :
- + 180 C
- Minimum Operating Temperature :
- - 60 C
- Product :
- Thermally Conductive Insulator
- Series :
- 800 / TSP 1600
- Tensile Strength :
- 12 MPa
- Thickness :
- 0.127 mm
Description
Thermal Interface Products Sil-Pad, 0.005 Inch Thick, Sil-Pad TSP 1600/Sil-Pad 800
Price & Procurement
Associated Product
-
-
-
-
-
-
-
Amphenol FCIAutomotive Connectors Minitek MicroSpaceXS,1.27mm Crimp-to-Wire Connector Platform, Wire to Board Header, 3 Position., STG, Top Latch, Gold, WaterProof
-
-
-
You May Also Be Interested In
STM32G031K4T6
EFM32TG210F8-D-QFN32R
EFM32GG12B830F512IL120-A
CEC1702Q-S1-I/SX
EFM32WG995F256-B-BGA120
EFM32TG110F16-D-QFN24R
EFM32GG12B510F1024IL120-A
LPC5512JBD64K
EFM32HG308F64N-C-QFN24R
EFM32HG309F32G-C-QFN24R
EFM32GG295F512G-E-BGA120
CP8386ATT
ATSAMD51G19A-MU-EFP
EFM32TG222F8-D-QFP48R
EFM32HG309F32N-C-QFN24R
FS32K142WAT0WLFT
EFM32HG210F32G-C-QFN32R
EFM32HG309F64G-C-QFN24R
EFM32GG895F512G-E-BGA120
MKL26Z32VLH4