Product overview
- Part Number
- SF500G-265005
- Manufacturer
- CUI Devices
- Product Category
- Thermal Interface Products
- Description
- Thermal Interface Products Thermal Pad, Silicone Elastomer, 3.5 W/m*K Thermal Conductivity
Documents & Media
- Datasheets
- SF500G-265005
Product Attributes
- Breakdown Voltage :
- 2.5 kVAC
- Color :
- Blue
- Length :
- 26.25 mm
- Material :
- Silicone Elastomer
- Maximum Operating Temperature :
- + 200 C
- Minimum Operating Temperature :
- - 58 C
- Product :
- Thermally Conductive Gap Pad
- Series :
- SF500G
- Tensile Strength :
- 25 psi
- Thermal Conductivity :
- 3.5 W/m-K
- Thickness :
- 0.5 mm
- Width :
- 50 mm
Description
Thermal Interface Products Thermal Pad, Silicone Elastomer, 3.5 W/m*K Thermal Conductivity
Price & Procurement
Associated Product
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-
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Amphenol FCIAutomotive Connectors Minitek MicroSpaceXS,1.27mm Crimp-to-Wire Connector Platform, Wire to Board Header, 3 Position., STG, Top Latch, Gold, WaterProof
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