Product overview
- Part Number
- SF500-202005
- Manufacturer
- CUI Devices
- Product Category
- Thermal Interface Products
- Description
- Thermal Interface Products Thermal Pad, Silicone Elastomer, 3.0 W/m*K Thermal Conductivity
Documents & Media
- Datasheets
- SF500-202005
Product Attributes
- Breakdown Voltage :
- 2.5 kVAC
- Color :
- Blue
- Length :
- 20 mm
- Material :
- Silicone Elastomer
- Maximum Operating Temperature :
- + 200 C
- Minimum Operating Temperature :
- - 58 C
- Product :
- Thermally Conductive Gap Pad
- Series :
- SF500
- Tensile Strength :
- 25 psi
- Thermal Conductivity :
- 3 W/m-K
- Thickness :
- 0.5 mm
- Width :
- 20 mm
Description
Thermal Interface Products Thermal Pad, Silicone Elastomer, 3.0 W/m*K Thermal Conductivity
Price & Procurement
Associated Product
-
-
-
-
-
-
-
Amphenol FCIAutomotive Connectors Minitek MicroSpaceXS,1.27mm Crimp-to-Wire Connector Platform, Wire to Board Header, 3 Position., STG, Top Latch, Gold, WaterProof
-
-
-
You May Also Be Interested In
D38999/26GJ61SC
D38999/26GJ61SE
D38999/26GJ61SD
D38999/26GJ61SB
801-011-07NF17-14SA
ZPF000000000201223
JN1003FG24-61SN-1
805-003-07M15-37PC
801-007-26M17-14SA
801-008-16NF17-14SA
M28840/16AC1S5
M28840/16AC1G5
YACT26MJ37JB000000
YACT26MJ37JA000000
YACT26MJ37JE000000
YACT26MJ37JC000000
YACT26MJ37JD000000
YACT26MJ37JN000000
803-003-02NF12-37SN
ZPF000000000013268