CD-02-05-C-18 - Wakefield-Vette

Description: Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.689 Inch x 0.689 Inch, No Hole

Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.689 Inch x 0.689 Inch, No Hole

709215999003825+

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YB226CWCSW01 YB226CWCSW01/CUL YB225CWCSG01/CUL YB225CWCSG01 YB25WMKG01-2CF05-JB YB226CWCSG01/CUL YB215CWCSW01/CUL-5C-JB LP6OA1ASGB LP6OA1ASYB YB215CWCSW01-5C-JS YB225CWCSW01/CUL-5C-JB YB225CWCSW01/CUL-5C-CB YB215CWCSW01-5D12-JB YB215CWCSW01-5C24-JB YB215CWCSW01-5C12-JB YB215CWCSW01-5D-JS YB225CWSKW01/CUL-5C24-CB YB226CWCSW01-5C-CB YB216CWCSW01-5C-JS YB216CWCSW01-5D-JS