Product overview
- Part Number
- AF500-202005
- Manufacturer
- CUI Devices
- Product Category
- Thermal Interface Products
- Description
- Thermal Interface Products Thermal Pad, Non-Silicone Elastomer, 3.0 W/m*K Thermal Conductivity
Documents & Media
- Datasheets
- AF500-202005
Product Attributes
- Breakdown Voltage :
- 2.5 kVAC
- Color :
- Gray
- Length :
- 20 mm
- Material :
- Non-Silicone Elastomer
- Maximum Operating Temperature :
- + 125 C
- Minimum Operating Temperature :
- - 45 C
- Product :
- Thermally Conductive Gap Pad
- Series :
- AF500
- Tensile Strength :
- 30 psi
- Thermal Conductivity :
- 3 W/m-K
- Thickness :
- 0.5 mm
- Width :
- 20 mm
Description
Thermal Interface Products Thermal Pad, Non-Silicone Elastomer, 3.0 W/m*K Thermal Conductivity
Price & Procurement
Associated Product
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-
-
-
-
-
-
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Amphenol FCIAutomotive Connectors Minitek MicroSpaceXS,1.27mm Crimp-to-Wire Connector Platform, Wire to Board Header, 3 Position., STG, Top Latch, Gold, WaterProof
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