Product overview
- Part Number
- 341900F00000G
- Manufacturer
- Aavid, Thermal Division of Boyd Corporation
- Product Category
- Heat Sinks
- Description
- Heat Sinks Thin-Fin, Board Level, Stamped Heat Sink for PCI/AGP Chip Sets, Thin Fin, Copper, Horizontal/Vertical Mounting, 25.4x76.2x0.33mm
Documents & Media
- Datasheets
- 341900F00000G
Product Attributes
- Designed for :
- BGA, PGA, QFP
- Heatsink Material :
- Copper
- Height :
- 0.33 mm
- Length :
- 76.2 mm
- Mounting Style :
- Adhesive
- Product :
- Heat Sinks
- Width :
- 25.4 mm
Description
Heat Sinks Thin-Fin, Board Level, Stamped Heat Sink for PCI/AGP Chip Sets, Thin Fin, Copper, Horizontal/Vertical Mounting, 25.4x76.2x0.33mm
Price & Procurement
Associated Product
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Amphenol FCIAutomotive Connectors Minitek MicroSpaceXS,1.27mm Crimp-to-Wire Connector Platform, Wire to Board Header, 3 Position., STG, Top Latch, Gold, WaterProof
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