341600F00000G - Aavid, Thermal Division of Boyd Corporation

Description: Heat Sinks Thin-Fin, Stamped Heat Sink for PCI/AGP Chip Sets, Low Profile, Copper, 50.8x12.7x12.7mm

Heat Sinks Thin-Fin, Stamped Heat Sink for PCI/AGP Chip Sets, Low Profile, Copper, 50.8x12.7x12.7mm

709215999003825+

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emmc 4GB
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SNFPU036808J3CJS00 SNFPU036808J3AJS00 SNFPU036808J3OJS00 FKP2F016801I00MC00 FKP3C021502C00MB00 FKP3C021502C00MD00 FKP2F016801I00MI00 FKP2F016801I00MA00 FKP2F016801I00MF00 FKP4T032207F00KSC9 DCP4I059009FD4MSSD DCP4I059009FD4KSSD MKP4R034706I00JSSD MKP1G023903G00KSC9 MKS4S021004B00JSC9 MKP1V011504B00KSC9 MKP1U021204F00MSC9 MKP1G024703G00KSC9 MKP1U014704B00KSC9 MKP1U012704B00KSC9