Product overview
- Part Number
- conga-SMX8/i-HSP-B
- Manufacturer
- congatec
- Product Category
- Heat Sinks
- Description
- Heat Sinks Heat spreader solution for SMARC 2.0 module conga-SMX8 with lidded NXP i.MX 8 ARM processor. All standoffs are with 2.7mm bore hole.
Documents & Media
- Datasheets
- conga-SMX8/i-HSP-B
Product Attributes
- Designed for :
- conga-SMX8
Description
Heat Sinks Heat spreader solution for SMARC 2.0 module conga-SMX8 with lidded NXP i.MX 8 ARM processor. All standoffs are with 2.7mm bore hole.
Price & Procurement
Associated Product
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Amphenol FCIAutomotive Connectors Minitek MicroSpaceXS,1.27mm Crimp-to-Wire Connector Platform, Wire to Board Header, 3 Position., STG, Top Latch, Gold, WaterProof
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