Product overview
- Part Number
- BDN09-3CB
- Manufacturer
- CTS Electronic Components
- Product Category
- Heat Sinks
- Description
- Heat Sinks
Documents & Media
- Datasheets
- BDN09-3CB
Product Attributes
- Designed for :
- BGA, PGA, PLCC, QFP
- Fin Style :
- Vertical Fin
- Heatsink Material :
- Aluminum
- Height :
- 2.31 mm
- Length :
- 23.1 mm
- Mounting Style :
- Adhesive
- Product :
- Heat Sinks
- Thermal Resistance :
- 26.9 C/W
- Width :
- 27.1 mm
Description
Heat Sinks
Price & Procurement
Associated Product
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Amphenol FCIAutomotive Connectors Minitek MicroSpaceXS,1.27mm Crimp-to-Wire Connector Platform, Wire to Board Header, 3 Position., STG, Top Latch, Gold, WaterProof
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