Product overview
- Part Number
- 609-50ABS3
- Manufacturer
- Wakefield-Vette
- Product Category
- Heat Sinks
- Description
- Heat Sinks Pin Fin Heat Sink/Clip Assembly for 40/45mm BGA and PowerPC Packages, Aluminum, Black Anodized, 73.5x50.8x12.7mm, Bergquist Q-Pad 3, 0.14 C in2/w
Documents & Media
- Datasheets
- 609-50ABS3
Product Attributes
- Designed for :
- BGA, Super BGA, PBGA, FPBGA, PowerPC
- Fin Style :
- Extruded Axial Fin
- Heatsink Material :
- Aluminum
- Mounting Style :
- Screw
- Product :
- Heat Sinks
Description
Heat Sinks Pin Fin Heat Sink/Clip Assembly for 40/45mm BGA and PowerPC Packages, Aluminum, Black Anodized, 73.5x50.8x12.7mm, Bergquist Q-Pad 3, 0.14 C in2/w
Price & Procurement
Associated Product
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Amphenol FCIAutomotive Connectors Minitek MicroSpaceXS,1.27mm Crimp-to-Wire Connector Platform, Wire to Board Header, 3 Position., STG, Top Latch, Gold, WaterProof
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