Product overview
- Part Number
- conga-TCA5/i-CSP-B
- Manufacturer
- congatec
- Product Category
- Heat Sinks
- Description
- Heat Sinks Passive cooling solution for COM Express Compact module conga-TCA5 with lidded Intel Atom processor. All standoffs are with 2.7mm bore hole.
Documents & Media
- Datasheets
- conga-TCA5/i-CSP-B
Product Attributes
- Designed for :
- conga-TCA5
- Product :
- Heat Sinks
Description
Heat Sinks Passive cooling solution for COM Express Compact module conga-TCA5 with lidded Intel Atom processor. All standoffs are with 2.7mm bore hole.
Price & Procurement
Associated Product
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Amphenol FCIAutomotive Connectors Minitek MicroSpaceXS,1.27mm Crimp-to-Wire Connector Platform, Wire to Board Header, 3 Position., STG, Top Latch, Gold, WaterProof
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