Product overview
- Part Number
- 3-1969594-2
- Manufacturer
- TE Connectivity
- Product Category
- Headers & Wire Housings
- Description
- Headers & Wire Housings HSG,REC,PANEL MOUNT DUALROW,EP2.5
Documents & Media
- Datasheets
- 3-1969594-2
Product Attributes
- Application :
- Wire-to-Wire
- Maximum Operating Temperature :
- + 105 C
- Minimum Operating Temperature :
- - 25 C
- Mounting Angle :
- Straight
- Number of Positions :
- 32 Position
- Number of Rows :
- 2 Row
- Packaging :
- Bulk
- Pitch :
- 2.5 mm
- Product :
- Wire Housings
- Series :
- Economy Power 2.5
- Termination Style :
- Crimp
- Type :
- Receptacle Housing
- Wire Gauge :
- 26 AWG to 22 AWG
Description
Headers & Wire Housings HSG,REC,PANEL MOUNT DUALROW,EP2.5
Price & Procurement
Associated Product
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Amphenol FCIAutomotive Connectors Minitek MicroSpaceXS,1.27mm Crimp-to-Wire Connector Platform, Wire to Board Header, 3 Position., STG, Top Latch, Gold, WaterProof
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