Product overview
- Part Number
- 212209-2023
- Manufacturer
- Molex
- Product Category
- Headers & Wire Housings
- Description
- Headers & Wire Housings CP3.3 Rcp Hsg 3.30mm DR PsLck GW 2Ckt Ylw
Documents & Media
- Datasheets
- 212209-2023
Product Attributes
- Application :
- Power, Wire-to-Board
- Maximum Operating Temperature :
- + 105 C
- Minimum Operating Temperature :
- - 40 C
- Mounting Angle :
- Straight
- Mounting Style :
- Cable Mount / Free Hanging
- Number of Positions :
- 2 Position
- Number of Rows :
- 2 Row
- Packaging :
- Bulk
- Pitch :
- 3.3 mm
- Product :
- Wire Housings
- Series :
- 212209
- Termination Style :
- Crimp
- Tradename :
- CP-3.3
- Type :
- Receptacle Housing
Description
Headers & Wire Housings CP3.3 Rcp Hsg 3.30mm DR PsLck GW 2Ckt Ylw
Price & Procurement
Associated Product
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Amphenol FCIAutomotive Connectors Minitek MicroSpaceXS,1.27mm Crimp-to-Wire Connector Platform, Wire to Board Header, 3 Position., STG, Top Latch, Gold, WaterProof
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