Product overview
- Part Number
- 5-102393-3
- Manufacturer
- TE Connectivity
- Product Category
- Headers & Wire Housings
- Description
- Headers & Wire Housings HSG DUAL 10P 30-26
Documents & Media
- Datasheets
- 5-102393-3
Product Attributes
- Contact Gender :
- Socket (Female)
- Contact Plating :
- Gold
- Maximum Operating Temperature :
- + 105 C
- Minimum Operating Temperature :
- - 65 C
- Mounting Style :
- Cable Mount / Free Hanging
- Number of Positions :
- 10 Position
- Number of Rows :
- 2 Row
- Pitch :
- 2.54 mm
- Product :
- Wire Housings
- Row Spacing :
- 2.54 mm
- Series :
- AMPMODU MT
- Termination Style :
- IDC
- Tradename :
- AMPMODU
- Type :
- Receptacle Housing
Description
Headers & Wire Housings HSG DUAL 10P 30-26
Price & Procurement
Associated Product
-
-
-
-
-
-
-
-
Amphenol FCIAutomotive Connectors Minitek MicroSpaceXS,1.27mm Crimp-to-Wire Connector Platform, Wire to Board Header, 3 Position., STG, Top Latch, Gold, WaterProof
-
-
You May Also Be Interested In
ISC1812ES681J
IMC0402ER4N7S01
IMC0402ER3N9S01
IMC0402ER23NJ01
ISC1812ES561J
IMC0402ER39NJ01
IMC0402ER6N8J01
IMC0402ER1N8S01
IMC0402ER19NJ01
IMC0402ER11NJ01
IMC0402ER1N0S01
IMC0402ER9N0J01
LQP02TN30NH02L
IMC0402ER9N0K01
LQP02TN36NH02L
IMC0402ER3N6S01
IMC0402ER36NJ01
IMC0402ER6N2J01
XFL2006-683MEC
XFL2006-682MEC