Documents & Media
- Datasheets
- TS991SNL500T4
Product Attributes
- Alloy :
- Sn96.5/Ag3.0/Cu0.5
- Contains Lead :
- NO
- Description/Function :
- Synthetic No-Clean
- Package Type :
- Jar
- Product :
- Solder
- Size :
- 500 g
- Type :
- Paste, No Clean
Description
Solder Thermally Stable Solder Paste NC (No-Clean) Sn96.5/Ag3.0/Cu0.5 T4 (500g jar)
Price & Procurement
Associated Product
-
-
-
-
-
-
-
-
Amphenol FCIAutomotive Connectors Minitek MicroSpaceXS,1.27mm Crimp-to-Wire Connector Platform, Wire to Board Header, 3 Position., STG, Top Latch, Gold, WaterProof
-
-
You May Also Be Interested In
06033K270JBTTR
04023J0R3ABWTR
06033J220JBTTR
04023J1R2ABWTR\500
600S4R3DW250XT
04021JR75PBWTR\500
04023J0R5PBWTR\500
06033K180JBTTR
04023J2R1ABWTR\500
04021J1R0PBWTR\500
04023J1R0ABWTR\500
600S1R3DW250XT
04023J0R7PBWTR\500
04023J0R3PBWTR\500
04021JR65PBWTR\500
04023J1R1ABWTR\500
04021J0R6PBWTR\500
06035J8R2DBTTR
600L4R3DW200T
04023J1R5ABWTR\500