Documents & Media
- Datasheets
- TS391SNL250
Product Attributes
- Alloy :
- Sn96.5/Ag3.0/Cu0.5
- Contains Lead :
- NO
- Description/Function :
- Thermally stable solder paste 250g jar
- Package Type :
- Jar
- Product :
- Solder
- Type :
- Paste, No Clean
Description
Solder Paste NoCln 250g T4 Sn96.5/Ag3.0/Cu0.5
Price & Procurement
Associated Product
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Amphenol FCIAutomotive Connectors Minitek MicroSpaceXS,1.27mm Crimp-to-Wire Connector Platform, Wire to Board Header, 3 Position., STG, Top Latch, Gold, WaterProof
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