Documents & Media
- Datasheets
- SMDSWLF.008 50g
Product Attributes
- Alloy :
- Sn96.5/Ag3/Cu0.5
- Contains Lead :
- Yes
- Core Size :
- 1.2 %
- Diameter :
- 0.2 mm
- Package Type :
- Spool
- Product :
- Solder
- Type :
- Wire
Description
Solder LF Solder Wire 96.5/3/0.5 Tin/Silver/Copper no-clean .008 50g ULTRA THIN
Price & Procurement
Associated Product
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Amphenol FCIAutomotive Connectors Minitek MicroSpaceXS,1.27mm Crimp-to-Wire Connector Platform, Wire to Board Header, 3 Position., STG, Top Latch, Gold, WaterProof
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