Product overview
- Part Number
- 53266-0629
- Manufacturer
- Molex
- Product Category
- Headers & Wire Housings
- Description
- Headers & Wire Housings 7.0 WtB Wafer Assy R B Wafer Assy RA 6Ck
Documents & Media
- Datasheets
- 53266-0629
Product Attributes
- Contact Plating :
- Tin
- Maximum Operating Temperature :
- + 105 C
- Minimum Operating Temperature :
- - 40 C
- Mounting Angle :
- Right Angle
- Mounting Style :
- -
- Number of Positions :
- 6 Position
- Number of Rows :
- 1 Row
- Pitch :
- 7 mm
- Product :
- Headers
- Series :
- 53266
- Termination Style :
- Solder Pin
- Type :
- Shrouded
Description
Headers & Wire Housings 7.0 WtB Wafer Assy R B Wafer Assy RA 6Ck
Price & Procurement
Associated Product
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-
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Amphenol FCIAutomotive Connectors Minitek MicroSpaceXS,1.27mm Crimp-to-Wire Connector Platform, Wire to Board Header, 3 Position., STG, Top Latch, Gold, WaterProof
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