Product overview
- Part Number
- 1-87456-9
- Manufacturer
- TE Connectivity
- Product Category
- Headers & Wire Housings
- Description
- Headers & Wire Housings 24 MODIV HSG COMP DR
Documents & Media
- Datasheets
- 1-87456-9
Product Attributes
- Application :
- Wire-to-Board
- Contact Gender :
- -
- Contact Plating :
- -
- Mating Post Length :
- -
- Maximum Operating Temperature :
- + 105 C
- Minimum Operating Temperature :
- - 65 C
- Mounting Angle :
- -
- Mounting Style :
- -
- Number of Positions :
- 24 Position
- Number of Rows :
- 2 Row
- Pitch :
- 2.54 mm
- Product :
- Wire Housings
- Row Spacing :
- 2.54 mm
- Series :
- AMPMODU MOD IV
- Termination Post Length :
- -
- Termination Style :
- -
- Tradename :
- AMPMODU
- Type :
- Receptacle Housing
Description
Headers & Wire Housings 24 MODIV HSG COMP DR
Price & Procurement
Associated Product
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-
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-
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Amphenol FCIAutomotive Connectors Minitek MicroSpaceXS,1.27mm Crimp-to-Wire Connector Platform, Wire to Board Header, 3 Position., STG, Top Latch, Gold, WaterProof
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