Product overview
- Part Number
- 51146-0300
- Manufacturer
- Molex
- Product Category
- Headers & Wire Housings
- Description
- Headers & Wire Housings 1.25MM HSG. 3 CKT Ultra Low Profile
Documents & Media
- Datasheets
- 51146-0300
Product Attributes
- Application :
- Power, Wire-to-Board
- Contact Gender :
- Socket (Female)
- Contact Plating :
- Tin
- Maximum Operating Temperature :
- + 85 C
- Minimum Operating Temperature :
- - 40 C
- Mounting Style :
- Cable Mount / Free Hanging
- Number of Positions :
- 3 Position
- Number of Rows :
- 1 Row
- Packaging :
- Bulk
- Pitch :
- 1.25 mm
- Product :
- Wire Housings
- Series :
- 51146
- Termination Style :
- Crimp
- Tradename :
- PanelMate
- Type :
- Receptacle Housing
Description
Headers & Wire Housings 1.25MM HSG. 3 CKT Ultra Low Profile
Price & Procurement
Associated Product
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Amphenol FCIAutomotive Connectors Minitek MicroSpaceXS,1.27mm Crimp-to-Wire Connector Platform, Wire to Board Header, 3 Position., STG, Top Latch, Gold, WaterProof
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