Documents & Media
- Datasheets
- IS61DDP2B251236A-400M3L
Product Attributes
- Interface Type :
- Parallel
- Maximum Clock Frequency :
- 400 MHz
- Maximum Operating Temperature :
- + 70 C
- Memory Size :
- 18 Mbit
- Minimum Operating Temperature :
- 0 C
- Mounting Style :
- SMD/SMT
- Organization :
- 512 k x 36
- Package / Case :
- FBGA-165
- Packaging :
- Tray
- Supply Current - Max :
- 1.3 A
- Supply Voltage - Max :
- 1.9 V
- Supply Voltage - Min :
- 1.7 V
Description
SRAM 18Mb, DDR IIP (Burst of 2) CIO, Sync SRAM, 512K x 36, 2.0 Read Latency, 165 Ball FBGA (15x17 mm), RoHS
Price & Procurement
Associated Product
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Amphenol FCIAutomotive Connectors Minitek MicroSpaceXS,1.27mm Crimp-to-Wire Connector Platform, Wire to Board Header, 3 Position., STG, Top Latch, Gold, WaterProof
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