Product overview
- Part Number
- W71NW11HC1DW
- Manufacturer
- Winbond
- Product Category
- Multichip Packages
- Description
- Multichip Packages 1G-bit 1.8V NAND + 512Mb LPDDR1 MCP x16/x16
Documents & Media
- Datasheets
- W71NW11HC1DW
Product Attributes
- Maximum Clock Frequency :
- 29 MHz, 200 MHz
- Maximum Operating Temperature :
- + 85 C
- Memory Size :
- 1 Gbit, 512 Mbit
- Minimum Operating Temperature :
- - 40 C
- Mounting Style :
- SMD/SMT
- Series :
- W71NW11HC
- Type :
- NAND Flash, LPDDR1
Description
Multichip Packages 1G-bit 1.8V NAND + 512Mb LPDDR1 MCP x16/x16
Price & Procurement
Associated Product
-
-
-
-
-
-
-
-
Amphenol FCIAutomotive Connectors Minitek MicroSpaceXS,1.27mm Crimp-to-Wire Connector Platform, Wire to Board Header, 3 Position., STG, Top Latch, Gold, WaterProof
-
-
You May Also Be Interested In
CLM-9-50-70-18-AC30-F4-3
CLM-9-50-80-18-AC30-F4-3
CLM-9-65-70-36-AC30-F4-3
CLM-9-35-80-18-AC32-F4-3
CLM-9-50-95-18-AC30-F4-3
CLM-9-65-80-18-AC30-F4-3
CLM-9-30-90-36-AC32-F4-3
CLM-9-30-80-36-AC32-F4-3
CLM-9-18-70-36-AC38-F4-3
CHM-9-30-80-36-AA12-F3-3
CHM-9-30-90-36-AA12-F3-3
CHM-9-35-95-36-AA10-F3-3
SST-90-W40S-T11-M2500
CHM-9-30-95-36-AA00-F2-3
SST-90-W45S-T11-M2400
CHM-9-65-80-36-AA00-F2-3
CHM-9-35-80-36-AA02-F2-3
CHM-9-65-80-36-AA10-F3-3
CHM-9-27-95-36-AA00-F2-3
CHM-9-50-80-36-AA10-F3-3