Product overview
- Part Number
- W71NW10GF3FW
- Manufacturer
- Winbond
- Product Category
- Multichip Packages
- Description
- Multichip Packages 1G-bit 1.8V NAND + 1G-bit LPDDR2 MCP x8/x32
Documents & Media
- Datasheets
- W71NW10GF3FW
Product Attributes
- Maximum Clock Frequency :
- 29 MHz, 533 MHz
- Maximum Operating Temperature :
- + 85 C
- Memory Size :
- 1 Gbit, 1 Gbit
- Minimum Operating Temperature :
- - 40 C
- Mounting Style :
- SMD/SMT
- Series :
- W71NW10GF
- Type :
- NAND Flash, LPDDR2
Description
Multichip Packages 1G-bit 1.8V NAND + 1G-bit LPDDR2 MCP x8/x32
Price & Procurement
Associated Product
-
-
-
-
-
-
-
-
Amphenol FCIAutomotive Connectors Minitek MicroSpaceXS,1.27mm Crimp-to-Wire Connector Platform, Wire to Board Header, 3 Position., STG, Top Latch, Gold, WaterProof
-
-
You May Also Be Interested In
EJH-107-02-F-D-SM-TR
MMT-120-01-L-SH
MMT-110-02-F-DH-P-TR
SSM-110-SM-DV-BE-LC
TSW-110-18-H-D
SHF-106-01-F-D-SM-K-TR
TSM-110-01-SM-DV-A-TR
TSW-126-16-F-D
HTS-107-G-E
TSM-120-01-L-SH-LC-P-TR
TSM-118-01-L-DV-TR
HTSW-124-08-F-D-RA
SFMC-115-L3-F-D
TST-125-04-L-S-RA
ESQT-111-02-F-D-350
TSM-112-01-L-DH-A-P
SSM-113-L-DV-TR
ESQT-111-02-F-D-800
TSM-114-02-G-DV-A
TMS-150-02-G-S