Product overview
- Part Number
- W71NW10GE3FW
- Manufacturer
- Winbond
- Product Category
- Multichip Packages
- Description
- Multichip Packages 1G-bit 1.8V NAND + 512Mb LPDDR2 MCP x8/x32
Documents & Media
- Datasheets
- W71NW10GE3FW
Product Attributes
- Maximum Clock Frequency :
- 29 MHz, 400 MHz
- Maximum Operating Temperature :
- + 85 C
- Memory Size :
- 1 Gbit, 512 Mbit
- Minimum Operating Temperature :
- - 40 C
- Mounting Style :
- SMD/SMT
- Series :
- W71NW10GE
- Type :
- NAND Flash, LPDDR2
Description
Multichip Packages 1G-bit 1.8V NAND + 512Mb LPDDR2 MCP x8/x32
Price & Procurement
Associated Product
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Amphenol FCIAutomotive Connectors Minitek MicroSpaceXS,1.27mm Crimp-to-Wire Connector Platform, Wire to Board Header, 3 Position., STG, Top Latch, Gold, WaterProof
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