Product overview
- Part Number
- 1-87631-7
- Manufacturer
- TE Connectivity
- Product Category
- Headers & Wire Housings
- Description
- Headers & Wire Housings 22 MODIV HSG COMP DR
Documents & Media
- Datasheets
- 1-87631-7
Product Attributes
- Application :
- Board to Board
- Contact Gender :
- -
- Contact Plating :
- -
- Mating Post Length :
- -
- Maximum Operating Temperature :
- + 105 C
- Minimum Operating Temperature :
- - 65 C
- Mounting Style :
- -
- Number of Positions :
- 22 Position
- Number of Rows :
- 2 Row
- Pitch :
- 2.54 mm
- Product :
- Wire Housings
- Row Spacing :
- 2.54 mm
- Series :
- AMPMODU MOD IV
- Termination Post Length :
- -
- Termination Style :
- -
- Tradename :
- AMPMODU
- Type :
- Receptacle Housing
Description
Headers & Wire Housings 22 MODIV HSG COMP DR
Price & Procurement
Associated Product
-
-
-
-
-
-
-
Amphenol FCIAutomotive Connectors Minitek MicroSpaceXS,1.27mm Crimp-to-Wire Connector Platform, Wire to Board Header, 3 Position., STG, Top Latch, Gold, WaterProof
-
-
-
You May Also Be Interested In
RS73G2ATTD1330B
RS73F2ATTD4120B
RS73F2ATTD64R9B
RS73G2ATTD7321B
RS73G2ATTD7501B
RS73G2ATTD7152B
RS73F2ATTD3240B
RS73G2ATTD3572C
RS73F2ATTD2050C
WK73S2BTTDR158F
RS73F2ATTD39R0C
RS73F2ATTD1823B
RS73F2ATTD5100B
RS73G2ATTD5233C
RS73F2ATTD1741C
AC2512FK-7W51K1L
RS73G2ATTD1872B
RS73G2ATTD1241C
RS73F2ATTD33R0B
RS73G2ATTD19R6B