Product overview
- Part Number
- 53254-1170
- Manufacturer
- Molex
- Product Category
- Headers & Wire Housings
- Description
- Headers & Wire Housings New 2.0 WtB Wafer As Wafer Assy RA 11Ckt
Documents & Media
- Datasheets
- 53254-1170
Product Attributes
- Application :
- Signal, Wire-to-Board
- Contact Gender :
- Pin (Male)
- Contact Plating :
- Tin
- Mating Post Length :
- 3.3 mm
- Maximum Operating Temperature :
- + 105 C
- Minimum Operating Temperature :
- - 40 C
- Mounting Angle :
- Right Angle
- Mounting Style :
- Through Hole
- Number of Positions :
- 11 Position
- Number of Rows :
- 1 Row
- Packaging :
- Tray
- Pitch :
- 2 mm
- Product :
- Headers
- Series :
- 53254
- Termination Post Length :
- 3.5 mm
- Termination Style :
- Solder Pin
- Tradename :
- Micro-Latch
- Type :
- Shrouded
Description
Headers & Wire Housings New 2.0 WtB Wafer As Wafer Assy RA 11Ckt
Price & Procurement
Associated Product
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Amphenol FCIAutomotive Connectors Minitek MicroSpaceXS,1.27mm Crimp-to-Wire Connector Platform, Wire to Board Header, 3 Position., STG, Top Latch, Gold, WaterProof
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