Product overview
- Part Number
- 55917-0830
- Manufacturer
- Molex
- Product Category
- Headers & Wire Housings
- Description
- Headers & Wire Housings 2.0 WtB Dual Con Dip Plg Hsg Assy 8Ckt
Documents & Media
- Datasheets
- 55917-0830
Product Attributes
- Application :
- Signal, Wire-to-Board
- Contact Gender :
- Pin (Male)
- Contact Plating :
- Tin
- Maximum Operating Temperature :
- + 105 C
- Minimum Operating Temperature :
- - 25 C
- Mounting Angle :
- Straight
- Mounting Style :
- Through Hole
- Number of Positions :
- 8 Position
- Number of Rows :
- 2 Row
- Packaging :
- Tray
- Pitch :
- 2 mm
- Product :
- Headers
- Row Spacing :
- 5 mm
- Series :
- 55917
- Termination Style :
- Solder Pin
- Tradename :
- MicroClasp
- Type :
- Shrouded
Description
Headers & Wire Housings 2.0 WtB Dual Con Dip Plg Hsg Assy 8Ckt
Price & Procurement
Associated Product
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Amphenol FCIAutomotive Connectors Minitek MicroSpaceXS,1.27mm Crimp-to-Wire Connector Platform, Wire to Board Header, 3 Position., STG, Top Latch, Gold, WaterProof
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