Product overview
- Part Number
- 2355825-3
- Manufacturer
- TE Connectivity
- Product Category
- Board to Board & Mezzanine Connectors
- Description
- Board to Board & Mezzanine Connectors 114 Position, 1.27mm Gold, Vertical
Documents & Media
- Datasheets
- 2355825-3
Product Attributes
- Contact Material :
- Copper
- Contact Plating :
- Gold
- Current Rating :
- 1.5 A
- Housing Material :
- Liquid Crystal Polymer (LCP)
- Maximum Data Rate :
- 32 Gbps
- Maximum Operating Temperature :
- + 125 C
- Minimum Operating Temperature :
- - 55 C
- Mounting Angle :
- Vertical
- Number of Positions :
- 114 Position
- Number of Rows :
- 6 Row
- Pitch :
- 1.27?mm
- Product :
- Receptacles
- Stack Height :
- 12?mm
- Termination Style :
- Solder Balls
- Voltage Rating :
- 250 VAC
Description
Board to Board & Mezzanine Connectors 114 Position, 1.27mm Gold, Vertical
Price & Procurement
Associated Product
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-
-
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Amphenol FCIAutomotive Connectors Minitek MicroSpaceXS,1.27mm Crimp-to-Wire Connector Platform, Wire to Board Header, 3 Position., STG, Top Latch, Gold, WaterProof
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