Product overview
- Part Number
- DPAM-04-07.0-S-3-2
- Manufacturer
- Samtec
- Product Category
- Board to Board & Mezzanine Connectors
- Description
- Board to Board & Mezzanine Connectors .085" X .100" DP Array Differential Pair Array Terminal
Documents & Media
- Datasheets
- DPAM-04-07.0-S-3-2
Product Attributes
- Contact Material :
- Copper Alloy
- Contact Plating :
- Gold
- Current Rating :
- 2.9 A
- Housing Material :
- Liquid Crystal Polymer (LCP)
- Maximum Operating Temperature :
- + 125 C
- Minimum Operating Temperature :
- - 55 C
- Mounting Angle :
- Straight
- Number of Rows :
- 3 Row
- Packaging :
- Tray
- Pitch :
- 2.16 mm
- Product :
- Headers
- Series :
- DPAM
- Termination Style :
- Solder Pin
- Voltage Rating :
- 300 V
Description
Board to Board & Mezzanine Connectors .085" X .100" DP Array Differential Pair Array Terminal
Price & Procurement
Associated Product
-
-
-
-
-
-
-
Amphenol FCIAutomotive Connectors Minitek MicroSpaceXS,1.27mm Crimp-to-Wire Connector Platform, Wire to Board Header, 3 Position., STG, Top Latch, Gold, WaterProof
-
-
-
You May Also Be Interested In
IDMS-20-T-03.00-C-R
TCMD-22-S-14.00-01
IDMS-22-T-04.00
IDSD-08-D-21.00-R
HCSD-15-D-04.00-01-T-G
TCMD-10-D-18.00-01-R
IDMD-17-T-12.00-T
IDMD-13-S-02.25-ST8
IDMS-14-T-10.00-C
FFSD-13-D-02.40-01-N
FFMD-10-T-05.35-01-N
TCSD-12-D-07.00-01-F-R
FFMD-09-T-07.00-01-N
IDSD-14-D-18.50-T
IDMD-08-T-21.30-G
IDMD-25-D-02.00-T-G
IDMD-11-T-05.00
IDSD-14-S-06.00-G-ST8
TCSD-05-D-07.50-01
IDSD-08-D-21.00