Product overview
- Part Number
- 470-2105-100
- Manufacturer
- Amphenol TCS
- Product Category
- Board to Board & Mezzanine Connectors
- Description
- Board to Board & Mezzanine Connectors 200P NeXLev Recept 380 Solder Balls
Documents & Media
- Datasheets
- 470-2105-100
Product Attributes
- Contact Material :
- Copper Alloy
- Contact Plating :
- Gold
- Current Rating :
- 1 A
- Housing Material :
- Liquid Crystal Polymer (LCP)
- Maximum Operating Temperature :
- + 105 C
- Minimum Operating Temperature :
- - 40 C
- Mounting Angle :
- Vertical
- Number of Positions :
- 200 Position
- Number of Rows :
- 20 Row
- Packaging :
- Tray
- Pitch :
- 1.15 mm
- Product :
- Receptacles
- Series :
- NeXLev
- Stack Height :
- 13 mm, 15 mm, 17 mm, 20 mm
- Termination Style :
- BGA
- Voltage Rating :
- 600 V
Description
Board to Board & Mezzanine Connectors 200P NeXLev Recept 380 Solder Balls
Price & Procurement
Associated Product
-
-
-
-
-
-
-
-
Amphenol FCIAutomotive Connectors Minitek MicroSpaceXS,1.27mm Crimp-to-Wire Connector Platform, Wire to Board Header, 3 Position., STG, Top Latch, Gold, WaterProof
-
-
You May Also Be Interested In
TSW-116-10-G-S
FTSH-105-02-F-DV-A
FTSH-107-02-F-D
TSM-104-01-SM-DV-P-TR
TSW-132-08-T-S-RA
MTSW-108-06-G-D-100
TSW-116-08-T-D-RA
FTS-106-02-L-D
TSW-122-07-L-S
TMM-112-01-T-D-RE
MMT-107-01-F-SH-K
TSM-105-01-SM-DV
SSM-110-L-SV-BE
TSW-120-29-T-S-RA
TSM-111-01-L-SH
BBL-110-T-E
TLW-111-01-F-S-RA
FTSH-105-01-F-MT
TSM-106-03-S-SV-P-TR
SFMC-102-02-L-D