Product overview
- Part Number
- SEAF8-50-05.0-S-04-3
- Manufacturer
- Samtec
- Product Category
- Board to Board & Mezzanine Connectors
- Description
- Board to Board & Mezzanine Connectors 0.80 mm .0315" PITCH ULTRA HIGH-DENSITY HIGH-SPEED OPEN PIN FIELD ARRAY
Documents & Media
- Datasheets
- SEAF8-50-05.0-S-04-3
Product Attributes
- Contact Material :
- Copper Alloy
- Contact Plating :
- Gold
- Current Rating :
- 1.3 A
- Housing Material :
- Liquid Crystal Polymer (LCP)
- Maximum Data Rate :
- 56 Gb/s
- Number of Positions :
- 200 Position
- Number of Rows :
- 4 Row
- Pitch :
- 0.8 mm
- Series :
- SEAF8
- Termination Style :
- Solder
Description
Board to Board & Mezzanine Connectors 0.80 mm .0315" PITCH ULTRA HIGH-DENSITY HIGH-SPEED OPEN PIN FIELD ARRAY
Price & Procurement
Associated Product
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Amphenol FCIAutomotive Connectors Minitek MicroSpaceXS,1.27mm Crimp-to-Wire Connector Platform, Wire to Board Header, 3 Position., STG, Top Latch, Gold, WaterProof
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