Product overview
- Part Number
- QFS-078-04.25-H-D-A-P
- Manufacturer
- Samtec
- Product Category
- Board to Board & Mezzanine Connectors
- Description
- Board to Board & Mezzanine Connectors 0.635 mm Q2 High-Speed Rugged Ground Plane Socket Strip
Documents & Media
- Datasheets
- QFS-078-04.25-H-D-A-P
Product Attributes
- Contact Material :
- Phosphor Bronze
- Contact Plating :
- Gold
- Current Rating :
- 2.6 A
- Housing Material :
- Liquid Crystal Polymer (LCP)
- Maximum Operating Temperature :
- + 125 C
- Minimum Operating Temperature :
- - 55 C
- Mounting Angle :
- Straight
- Number of Positions :
- 156 Position
- Number of Rows :
- 2 Row
- Packaging :
- Tray
- Pitch :
- 0.635 mm
- Product :
- Sockets
- Series :
- QFS
- Termination Style :
- Solder
- Voltage Rating :
- 300 VAC
Description
Board to Board & Mezzanine Connectors 0.635 mm Q2 High-Speed Rugged Ground Plane Socket Strip
Price & Procurement
Associated Product
-
-
-
-
-
-
-
Amphenol FCIAutomotive Connectors Minitek MicroSpaceXS,1.27mm Crimp-to-Wire Connector Platform, Wire to Board Header, 3 Position., STG, Top Latch, Gold, WaterProof
-
-
-
You May Also Be Interested In
PKG.M0.6NL.MN
PES.00.250.NTME31
PAG.M0.9TL.AC52N
FGJ.0B.304.CYZZ
HVP.03.250.CLLPV
PSS.2B.250.ZTME31
FFA.0S.116.CLAC32
FGB.0B.305.CYZZ
CAB.M02.GLA.C72G
FFC.00.650.CLAC31
PAG.M1.4GL.AC65GZ
320427
EGG.0T.307.CLL
PRG.M0.6GL.LC65G
BRF.2S.200.NAS
PRA.M0.6GL.LC52G
EPL.0S.116.DTL
EEG.0B.306.CLN
ECG.1B.302.CLN
FFA.0S.302.CLAC22