Product overview
- Part Number
- HDWM-36-57-G-D-350-SM
- Manufacturer
- Samtec
- Product Category
- Board to Board & Mezzanine Connectors
- Description
- Board to Board & Mezzanine Connectors .050 X .100 Flex Stack, High-Temp Micro Board Stacker
Documents & Media
- Datasheets
- HDWM-36-57-G-D-350-SM
Product Attributes
- Contact Material :
- Phosphor Bronze
- Contact Plating :
- Gold
- Housing Material :
- Liquid Crystal Polymer (LCP)
- Maximum Operating Temperature :
- + 125 C
- Minimum Operating Temperature :
- - 55 C
- Mounting Angle :
- Straight
- Number of Positions :
- 72 Position
- Number of Rows :
- 2 Row
- Packaging :
- Bulk
- Pitch :
- 1.27 mm
- Product :
- Headers
- Series :
- HDWM
- Stack Height :
- 8.89 mm
- Termination Style :
- Solder
Description
Board to Board & Mezzanine Connectors .050 X .100 Flex Stack, High-Temp Micro Board Stacker
Price & Procurement
Associated Product
-
-
-
-
-
-
-
Amphenol FCIAutomotive Connectors Minitek MicroSpaceXS,1.27mm Crimp-to-Wire Connector Platform, Wire to Board Header, 3 Position., STG, Top Latch, Gold, WaterProof
-
-
-
You May Also Be Interested In
FHG.2B.308.CLAM42
EGB.3K.330.CLL
PHG.3K.844.CLLC91Z
PHG.3B.813.CLLD01Z
FHG.3B.302.CYCD92
FHG.3B.303.CLAD92
PHG.3K.844.CLLC901
FGG.3B.844.CLCD722
FGJ.2B.435.CJAD99
FHG.3B.303.CLAD82
FHG.3B.303.CLAD11
FHG.3B.303.CLAD10
FGG.3B.812.CNAM52
FHG.2B.310.CLAD92
EGG.3B.856.CGL1
FHG.2B.310.CLAD99Z
FDG.2B.319.CLAD52
FHG.2B.310.CLAD82
FHG.2B.310.CLAD52Z
EGG.3B.856.CLM3