Product overview
- Part Number
- TW-08-03-G-D-330-SM-A-P
- Manufacturer
- Samtec
- Product Category
- Board to Board & Mezzanine Connectors
- Description
- Board to Board & Mezzanine Connectors Flexible Board Stacking Header, 2.00mm Pitch
Documents & Media
- Datasheets
- TW-08-03-G-D-330-SM-A-P
Product Attributes
- Contact Material :
- Phosphor Bronze
- Contact Plating :
- Gold
- Current Rating :
- 4.9 A
- Housing Material :
- Liquid Crystal Polymer (LCP)
- Maximum Operating Temperature :
- + 125 C
- Minimum Operating Temperature :
- - 55 C
- Mounting Angle :
- Vertical
- Number of Positions :
- 16 Position
- Number of Rows :
- 2 Row
- Packaging :
- Tube
- Pitch :
- 2 mm
- Product :
- Connectors
- Series :
- TW
- Stack Height :
- 8.382 mm
- Termination Style :
- Solder
Description
Board to Board & Mezzanine Connectors Flexible Board Stacking Header, 2.00mm Pitch
Price & Procurement
Associated Product
-
-
-
-
-
-
-
-
Amphenol FCIAutomotive Connectors Minitek MicroSpaceXS,1.27mm Crimp-to-Wire Connector Platform, Wire to Board Header, 3 Position., STG, Top Latch, Gold, WaterProof
-
-
You May Also Be Interested In
TNPW060330K9BEEA
TNPW0603205KBEEA
ERA-8AEB563V
TNPW0402267RBEED
TNPW040264K9BEED
CPF0402B12RE1
CPF0402B1K87E1
CPF0402B750RE1
CPF0402B9K1E1
CPF0402B86K6E1
MCS0402MD1501BE100
RP73PF1E124KBTDF
RP73PF1E49R9BTDF
RP73PF1E47K5BTDF
RP73PF1J20KBTDF
CPF0805B30KE1
CPF0603B9K09E1
CPF0603B105KE1
CPF0603B56RE1
CPF0603B237KE1