Product overview
- Part Number
- FW-13-04-F-D-606-089
- Manufacturer
- Samtec
- Product Category
- Board to Board & Mezzanine Connectors
- Description
- Board to Board & Mezzanine Connectors Flexible Micro Board Stacking Header, 0.050 Pitch
Documents & Media
- Datasheets
- FW-13-04-F-D-606-089
Product Attributes
- Contact Material :
- Phosphor Bronze
- Contact Plating :
- Gold
- Housing Material :
- Liquid Crystal Polymer (LCP)
- Maximum Operating Temperature :
- + 125 C
- Minimum Operating Temperature :
- - 55 C
- Mounting Angle :
- Straight
- Number of Positions :
- 26 Position
- Number of Rows :
- 2 Row
- Packaging :
- Tube
- Pitch :
- 1.27 mm
- Product :
- Headers
- Series :
- FW-TH
- Termination Style :
- Solder Pin
Description
Board to Board & Mezzanine Connectors Flexible Micro Board Stacking Header, 0.050 Pitch
Price & Procurement
Associated Product
-
-
-
-
-
-
-
Amphenol FCIAutomotive Connectors Minitek MicroSpaceXS,1.27mm Crimp-to-Wire Connector Platform, Wire to Board Header, 3 Position., STG, Top Latch, Gold, WaterProof
-
-
-
You May Also Be Interested In
P091S-1FC10AR1MEG
P091S-4QC15DR200K
P091S-FC15BR5K
P091S-4EC10DR200K
P091S-1QC10AR1MEG
P091S-4FC15DR2K
P091S-1QA10AR500K
P091S-FB15BR100K
P091S-3QC15AR5K
P091S-3FC15AR5K
P091S-1QA15CR50K
P091S-2QA15BR50K
P091S-3FB10DR10K
P091S-4FB10DR2K
P091S-3FA15BR500K
P091S-2EC15CR500
P091S-1FB10AR20K
P091S-3FA10BR500K
P091S-2FB15DR100K
P091S-4FD15DR50K