Product overview
- Part Number
- TW-19-08-F-S-555-130
- Manufacturer
- Samtec
- Product Category
- Board to Board & Mezzanine Connectors
- Description
- Board to Board & Mezzanine Connectors Flexible Board Stacking Header, 2.00mm Pitch
Documents & Media
- Datasheets
- TW-19-08-F-S-555-130
Product Attributes
- Contact Material :
- Phosphor Bronze
- Contact Plating :
- Gold
- Current Rating :
- 5.2 A
- Housing Material :
- Liquid Crystal Polymer (LCP)
- Maximum Operating Temperature :
- + 125 C
- Minimum Operating Temperature :
- - 55 C
- Mounting Angle :
- Vertical
- Number of Positions :
- 19 Position
- Number of Rows :
- 1 Row
- Packaging :
- Bulk
- Pitch :
- 2 mm
- Product :
- Connectors
- Series :
- TW
- Stack Height :
- 3.05 mm
- Termination Style :
- Solder
Description
Board to Board & Mezzanine Connectors Flexible Board Stacking Header, 2.00mm Pitch
Price & Procurement
Associated Product
-
-
-
-
-
-
-
Amphenol FCIAutomotive Connectors Minitek MicroSpaceXS,1.27mm Crimp-to-Wire Connector Platform, Wire to Board Header, 3 Position., STG, Top Latch, Gold, WaterProof
-
-
-
You May Also Be Interested In
AP105-GT19S-30S-ID
TM23P-88P/CK-MP(01)
AP105-DF24-36S
AP105-DF20K-2830S
AP105-GT36A-2022S
AP105-FX15-2830
AP105-FX15-3032(01)
2151089-2
2150251-1
2150250-2
2151434-2
AP105-DF19S(01)
AP105-FX16-3032
AP105-DF50-2830S
AP105-GT15T-2024S
AP105-GTA.B-0.7P
AP105-GT32-2428S
AP105-GTA.B-1.6P(01)
AP105-DF61-2630S
MS-130-C(P)/CCT(01)