Product overview
- Part Number
- FW-09-02-F-D-350-075
- Manufacturer
- Samtec
- Product Category
- Board to Board & Mezzanine Connectors
- Description
- Board to Board & Mezzanine Connectors Flexible Micro Board Stacking Header, 0.050 Pitch
Documents & Media
- Datasheets
- FW-09-02-F-D-350-075
Product Attributes
- Contact Material :
- Phosphor Bronze
- Contact Plating :
- Gold
- Housing Material :
- Liquid Crystal Polymer (LCP)
- Maximum Operating Temperature :
- + 125 C
- Minimum Operating Temperature :
- - 55 C
- Mounting Angle :
- Straight
- Number of Positions :
- 18 Position
- Number of Rows :
- 2 Row
- Packaging :
- Bulk
- Pitch :
- 1.27 mm
- Product :
- Headers
- Series :
- FW-TH
- Termination Style :
- Solder Pin
Description
Board to Board & Mezzanine Connectors Flexible Micro Board Stacking Header, 0.050 Pitch
Price & Procurement
Associated Product
-
-
-
-
-
-
-
Amphenol FCIAutomotive Connectors Minitek MicroSpaceXS,1.27mm Crimp-to-Wire Connector Platform, Wire to Board Header, 3 Position., STG, Top Latch, Gold, WaterProof
-
-
-
You May Also Be Interested In
PHG.2K.308.CLLC75Z
FGG.2K.306.CLCC65Z
FGG.2K.306.CLCC40Z
PHG.2K.308.CLLC30Z
PHG.2K.308.CLLC85Z
PHG.2K.308.CLLC55Z
PHG.2K.308.CLLC40Z
FGG.2K.306.CYCC70Z
FGG.2K.306.CLCC60Z
FGG.2K.306.CYCC55Z
FGG.3B.324.ZNA
FHG.0B.307.KLAD42
FFA.2E.308.CLAC85
FFA.2E.308.CLAC80
FFA.3S.302.CLAL97
FFA.2E.307.CLAC80
FAG.2K.307.CLA
FFA.2E.308.CLAC55
FHG.1B.302.CLAM31
FGA.2K.310.CYCZ
