Product overview

Part Number
LPAM-40-01.0-S-08-1-K-TR
Manufacturer
Samtec
Product Category
Board to Board & Mezzanine Connectors
Description
Board to Board & Mezzanine Connectors .050" LP Array HighSpeed HighDensity Low Profile OpenPinField Array, Terminal

Documents & Media

Product Attributes

Contact Material :
Copper Alloy
Contact Plating :
Gold
Current Rating :
2.2 A
Housing Material :
Liquid Crystal Polymer (LCP)
Maximum Operating Temperature :
+ 125 C
Minimum Operating Temperature :
- 55 C
Mounting Angle :
Straight
Packaging :
Cut Tape, Reel
Pitch :
1.27 mm
Product :
Headers
Series :
LPAM
Termination Style :
Solder
Voltage Rating :
250 V

Description

Board to Board & Mezzanine Connectors .050" LP Array HighSpeed HighDensity Low Profile OpenPinField Array, Terminal

Price & Procurement

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