Product overview
- Part Number
- 470-1155-100
- Manufacturer
- Amphenol TCS
- Product Category
- Board to Board & Mezzanine Connectors
- Description
- Board to Board & Mezzanine Connectors 100P NeXLev Recept 190 Solder Balls
Documents & Media
- Datasheets
- 470-1155-100
Product Attributes
- Contact Material :
- Copper Alloy
- Contact Plating :
- Gold
- Current Rating :
- 1 A
- Housing Material :
- Liquid Crystal Polymer (LCP)
- Maximum Operating Temperature :
- + 105 C
- Minimum Operating Temperature :
- - 40 C
- Mounting Angle :
- Vertical
- Number of Positions :
- 100 Position
- Number of Rows :
- 10 Row
- Pitch :
- 1.15 mm
- Product :
- Receptacles
- Series :
- NeXLev
- Stack Height :
- 10 mm, 20 mm, 22 mm
- Termination Style :
- BGA
- Voltage Rating :
- 600 V
Description
Board to Board & Mezzanine Connectors 100P NeXLev Recept 190 Solder Balls
Price & Procurement
Associated Product
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Amphenol FCIAutomotive Connectors Minitek MicroSpaceXS,1.27mm Crimp-to-Wire Connector Platform, Wire to Board Header, 3 Position., STG, Top Latch, Gold, WaterProof
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