Product overview
- Part Number
- HW-25-10-G-D-570-SM
- Manufacturer
- Samtec
- Product Category
- Board to Board & Mezzanine Connectors
- Description
- Board to Board & Mezzanine Connectors High Temperature Flexible Board Stacking Header, 0.100 Pitch
Documents & Media
- Datasheets
- HW-25-10-G-D-570-SM
Product Attributes
- Contact Material :
- Phosphor Bronze
- Contact Plating :
- Gold
- Housing Material :
- Liquid Crystal Polymer (LCP)
- Maximum Operating Temperature :
- + 125 C
- Minimum Operating Temperature :
- - 55 C
- Mounting Angle :
- Straight
- Number of Positions :
- 50 Position
- Number of Rows :
- 2 Row
- Packaging :
- Tube
- Pitch :
- 2.54 mm
- Product :
- Headers
- Series :
- HW
- Stack Height :
- 14.478 mm
- Termination Style :
- Solder
Description
Board to Board & Mezzanine Connectors High Temperature Flexible Board Stacking Header, 0.100 Pitch
Price & Procurement
Associated Product
-
-
-
-
-
-
-
Amphenol FCIAutomotive Connectors Minitek MicroSpaceXS,1.27mm Crimp-to-Wire Connector Platform, Wire to Board Header, 3 Position., STG, Top Latch, Gold, WaterProof
-
-
-
You May Also Be Interested In
GD5F1GQ4UFYIGR
GD5F1GQ4UEYIGR
MT29F4T08EQHBFG8-R:B
MT29F2T08ELHBFG7-R:B
GD5F1GQ4UEYIGY
GD5F1GQ4UFYIGY
GD5F1GQ4UEYIHR
GD5F1GQ4UEYIHY
MT29F1T08EEHBFJ4-M:B TR
MT29F2T08ELHBFG7-R:B TR
MT29F8T08ESHBFG4-R:B TR
MT29F4T08EQHBFG8-R:B TR
MT29F1T08EMHBFJ4-3R:B
MT29F2T08EMHBFJ4-M:B TR
TC58NVG2S0FTA00
W29N01HVSINF
TC58NVG3S0FTA00
TC58NYG2S3EBAI5
TC58NVG0S3ETAI0
TC58NYG0S3EBAI4