Product overview
- Part Number
- HW-08-11-G-D-665-SM
- Manufacturer
- Samtec
- Product Category
- Board to Board & Mezzanine Connectors
- Description
- Board to Board & Mezzanine Connectors High Temperature Flexible Board Stacking Header, 0.100 Pitch
Documents & Media
- Datasheets
- HW-08-11-G-D-665-SM
Product Attributes
- Contact Material :
- Phosphor Bronze
- Contact Plating :
- Gold
- Housing Material :
- Liquid Crystal Polymer (LCP)
- Maximum Operating Temperature :
- + 125 C
- Minimum Operating Temperature :
- - 55 C
- Mounting Angle :
- Straight
- Number of Positions :
- 16 Position
- Number of Rows :
- 2 Row
- Packaging :
- Tube
- Pitch :
- 2.54 mm
- Product :
- Headers
- Series :
- HW
- Stack Height :
- 16.891 mm
- Termination Style :
- Solder
Description
Board to Board & Mezzanine Connectors High Temperature Flexible Board Stacking Header, 0.100 Pitch
Price & Procurement
Associated Product
-
-
-
-
-
-
-
Amphenol FCIAutomotive Connectors Minitek MicroSpaceXS,1.27mm Crimp-to-Wire Connector Platform, Wire to Board Header, 3 Position., STG, Top Latch, Gold, WaterProof
-
-
-
You May Also Be Interested In
RN731ETTP2490D25
RN73R2ATTD1212D25
RN73R1JTTD2033B25
RN731JTTD4420B25
RN73H1JTTD2710F50
RN731ETTP3440D25
RN73H1JTTD1092F50
RN731ETTP1840B25
RN73H1JTTD53R0F50
RN731ETTP2581B25
RN73H1JTTD8870D25
RN73R2ATTD5601D25
RN732ATTD1420D25
RN732ATTD10R5D25
RN731JTTD24R3B25
RN731ETTP1270D25
RN73H1JTTD2152D25
RN73R1JTTD1982B25
RN731JTTD21R5B25
RN73R1ETTP1142B25