Product overview
- Part Number
- MVP-6023/M8G
- Manufacturer
- ADLINK Technology
- Product Category
- Embedded Box Computers
- Description
- Embedded Box Computers Intel Skylake-S i3-6100TE+Q170, 1pcs 8GB DDR4 SODIMM, VGA+DVI-D, 2xDP, 3xGbE, 4xUSB3.0, 2xUSB2.0, 1xSATA, 1xCFAST, 1xmPCIe, 1xUSIM, 4xCOM, 8DI+8DO, Line-Out+MIC-IN, 2PCIex8+2PCI slots, 12~24V DC-IN
Documents & Media
- Datasheets
- MVP-6023/M8G
Product Attributes
- Chipsets :
- Q170
- Dimensions :
- 220 mm x 210 mm x 208.7 mm
- Installed RAM :
- 8 GB
- Interface Type :
- Audio, Ethernet, PCIe, Serial, USB
- Maximum Operating Temperature :
- + 50 C
- Maximum RAM Capacity :
- 32 GB
- Minimum Operating Temperature :
- 0 C
- Operating Supply Voltage :
- 12 V to 24 V
- Processor Brand :
- intel
- Processor Type :
- Core i3
- Product Type :
- Embedded Box Computers
Description
Embedded Box Computers Intel Skylake-S i3-6100TE+Q170, 1pcs 8GB DDR4 SODIMM, VGA+DVI-D, 2xDP, 3xGbE, 4xUSB3.0, 2xUSB2.0, 1xSATA, 1xCFAST, 1xmPCIe, 1xUSIM, 4xCOM, 8DI+8DO, Line-Out+MIC-IN, 2PCIex8+2PCI slots, 12~24V DC-IN
Price & Procurement
Associated Product
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Amphenol FCIAutomotive Connectors Minitek MicroSpaceXS,1.27mm Crimp-to-Wire Connector Platform, Wire to Board Header, 3 Position., STG, Top Latch, Gold, WaterProof
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