Product overview
- Part Number
- 53364-1871
- Manufacturer
- Molex
- Product Category
- Board to Board & Mezzanine Connectors
- Description
- Board to Board & Mezzanine Connectors 0.8 BtB WaferAssySTW /OBoss18CktEmbsTpPkg
Documents & Media
- Datasheets
- 53364-1871
Product Attributes
- Contact Material :
- Copper
- Contact Plating :
- Tin
- Current Rating :
- 500 mA
- Housing Material :
- Thermoplastic (TP)
- Maximum Operating Temperature :
- + 105 C
- Minimum Operating Temperature :
- - 40 C
- Mounting Angle :
- Vertical
- Number of Positions :
- 18 Position
- Number of Rows :
- 2 Row
- Packaging :
- Cut Tape, MouseReel, Reel
- Pitch :
- 0.8 mm
- Product :
- Headers
- Series :
- 53364
- Stack Height :
- 6 mm, 7 mm
- Termination Style :
- Solder
- Voltage Rating :
- 50 V
Description
Board to Board & Mezzanine Connectors 0.8 BtB WaferAssySTW /OBoss18CktEmbsTpPkg
Price & Procurement
Associated Product
-
-
-
-
-
-
-
-
Amphenol FCIAutomotive Connectors Minitek MicroSpaceXS,1.27mm Crimp-to-Wire Connector Platform, Wire to Board Header, 3 Position., STG, Top Latch, Gold, WaterProof
-
-
You May Also Be Interested In
CA3102E18-21P-B-F80-05
ACT20MG11JDV001
ACT24JC08SNV001
ACT20MG11JEV001
YDJT10E09-35SNV001
ACT24MB35PAV001
ACT24JC04AN
ACT26MH53PBV001
YDTS26W21-11SNV001
ACT26MH53PEV001
ACT26MH53PNV001
ACT26MH53PCV001
ACT24JC04JEV001
DTS23N21-11SE
DS04-1912P-059
ACT26MH55PBV001
ACT26MH55PNV001
ACT26MH55PEV001
ACT26MH55PAV001
ACT26MH55PCV001