Product overview

Part Number
470-3155-600
Manufacturer
Amphenol TCS
Product Category
Board to Board & Mezzanine Connectors
Description
Board to Board & Mezzanine Connectors 300P NeXLev Recept Solder Balls

Documents & Media

Datasheets
470-3155-600

Product Attributes

Contact Material :
Copper Alloy
Contact Plating :
Gold
Current Rating :
1 A
Housing Material :
Liquid Crystal Polymer (LCP)
Maximum Data Rate :
12.5 Gb/s
Maximum Operating Temperature :
+ 105 C
Minimum Operating Temperature :
- 40 C
Mounting Angle :
Vertical
Number of Positions :
300 Position
Number of Rows :
30 Row
Packaging :
Tray
Pitch :
1.15 mm
Product :
Receptacles
Series :
NeXLev
Stack Height :
18 mm, 20 mm, 22 mm, 25 mm
Termination Style :
BGA
Voltage Rating :
600 V

Description

Board to Board & Mezzanine Connectors 300P NeXLev Recept Solder Balls

Price & Procurement

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