Product overview
- Part Number
- DF33-3S-3.3C
- Manufacturer
- Hirose Electric
- Product Category
- Board to Board & Mezzanine Connectors
- Description
- Board to Board & Mezzanine Connectors SOC HSG 3POS 3.3MM
Documents & Media
- Datasheets
- DF33-3S-3.3C
Product Attributes
- Contact Material :
- Copper Alloy
- Contact Plating :
- Tin
- Current Rating :
- 5 A
- Housing Material :
- Polyamide (PA)
- Maximum Operating Temperature :
- + 85 C
- Minimum Operating Temperature :
- - 35 C
- Mounting Angle :
- Straight
- Number of Positions :
- 3 Position
- Number of Rows :
- 1 Row
- Packaging :
- Bulk
- Pitch :
- 3.3 mm
- Product :
- Receptacles
- Series :
- DF33C
- Termination Style :
- Crimp
- Voltage Rating :
- 500 V
Description
Board to Board & Mezzanine Connectors SOC HSG 3POS 3.3MM
Price & Procurement
Associated Product
-
-
-
-
-
-
-
Amphenol FCIAutomotive Connectors Minitek MicroSpaceXS,1.27mm Crimp-to-Wire Connector Platform, Wire to Board Header, 3 Position., STG, Top Latch, Gold, WaterProof
-
-
-
You May Also Be Interested In
1206Y2000471JCT
1206Y5000471JCT
0805D122J500PHT
0805D222J250PHT
1812J3K00331GCT
0805D152J500PHT
1206Y0250471JCT
1206Y0630471JCT
1206J6300682KXT
1206Y2500471JCT
0805D182J500PHT
1206Y2K00821KXT
1206Y1000471JCT
202S41W471MV4E
2220J5K00221KCT
1808J5K00270JCT
1808J4K00270JCT
1812J5000562GCT
1206J2500272JCT
1206Y6300681JCT