Product overview
- Part Number
- CLP-122-02-G-D
- Manufacturer
- Samtec
- Product Category
- Board to Board & Mezzanine Connectors
- Description
- Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 0.050 Pitch
Documents & Media
- Datasheets
- CLP-122-02-G-D
Product Attributes
- Contact Material :
- Phosphor Bronze
- Contact Plating :
- Gold
- Current Rating :
- 3.4 A
- Housing Material :
- Liquid Crystal Polymer (LCP)
- Maximum Data Rate :
- 8 Gbps
- Maximum Operating Temperature :
- + 125 C
- Minimum Operating Temperature :
- - 55 C
- Mounting Angle :
- Vertical
- Number of Positions :
- 44 Position
- Number of Rows :
- 2 Row
- Packaging :
- Tube
- Pitch :
- 1.27 mm
- Product :
- Sockets
- Series :
- CLP
- Termination Style :
- Solder Pin
- Voltage Rating :
- 280 VAC, 395 VDC
Description
Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 0.050 Pitch
Price & Procurement
Associated Product
-
-
-
-
-
-
-
Amphenol FCIAutomotive Connectors Minitek MicroSpaceXS,1.27mm Crimp-to-Wire Connector Platform, Wire to Board Header, 3 Position., STG, Top Latch, Gold, WaterProof
-
-
-
You May Also Be Interested In
628W13W3622-2N2
790-028PL-6P6MGA
630-21W1650-1N3
630-21W1650-2NB
630-21W1650-1NB
630-21W1650-2N3
629-5W5-650-3N1
629-21W1650-1NE
629-9W4-650-1N1
629-21W1650-2N6
629-9W4-650-2N1
629-5W5-650-4N1
629-21W1650-2NE
629-21W1650-1N6
629-21W1640-2N1
629-21W1640-1N1
630-13W3650-2N2
630-13W3650-1NA
630-13W3650-2NA
630-13W3650-1N2