Product overview
- Part Number
- CLP-124-02-F-D-A
- Manufacturer
- Samtec
- Product Category
- Board to Board & Mezzanine Connectors
- Description
- Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 0.050 Pitch
Documents & Media
- Datasheets
- CLP-124-02-F-D-A
Product Attributes
- Contact Material :
- Phosphor Bronze
- Contact Plating :
- Gold
- Current Rating :
- 3.4 A
- Housing Material :
- Liquid Crystal Polymer (LCP)
- Maximum Data Rate :
- 8 Gbps
- Maximum Operating Temperature :
- + 125 C
- Minimum Operating Temperature :
- - 55 C
- Mounting Angle :
- Vertical
- Number of Positions :
- 48 Position
- Number of Rows :
- 2 Row
- Packaging :
- Tube
- Pitch :
- 1.27 mm
- Product :
- Sockets
- Series :
- CLP
- Termination Style :
- Solder Pin
- Voltage Rating :
- 280 VAC, 395 VDC
Description
Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 0.050 Pitch
Price & Procurement
Associated Product
-
-
-
-
-
-
-
Amphenol FCIAutomotive Connectors Minitek MicroSpaceXS,1.27mm Crimp-to-Wire Connector Platform, Wire to Board Header, 3 Position., STG, Top Latch, Gold, WaterProof
-
-
-
You May Also Be Interested In
CI-32139-000
RAI-33651-000
RAI-33767-000
RDI-33438-000
AS01608MS-SP9-WP-R
SW201108-1
SW350804-1
SW200508-1
SM150506-3
ASE02506MS-LW90-DSM-R
AS05308AS-R
CMS-16093-076SP
CMS-151135-076SP
CMS-15113-076SP
CMS-181325-078SP
CMS-151135-076S
CMS-15113-076SP-67
CMS-160925-078L100-67
AR01232MS-SC12-WP-R
SM360532-3