Product overview
- Part Number
- TW-10-09-S-D-195-SM-A-P-TR
- Manufacturer
- Samtec
- Product Category
- Board to Board & Mezzanine Connectors
- Description
- Board to Board & Mezzanine Connectors Flexible Board Stacking Header, 2.00mm Pitch
Documents & Media
- Datasheets
- TW-10-09-S-D-195-SM-A-P-TR
Product Attributes
- Contact Material :
- Phosphor Bronze
- Contact Plating :
- Gold
- Current Rating :
- 4.9 A
- Housing Material :
- Liquid Crystal Polymer (LCP)
- Maximum Data Rate :
- 8 Gbps
- Maximum Operating Temperature :
- + 125 C
- Minimum Operating Temperature :
- - 55 C
- Mounting Angle :
- Vertical
- Number of Positions :
- 20 Position
- Number of Rows :
- 2 Row
- Packaging :
- Cut Tape, Reel
- Pitch :
- 2 mm
- Product :
- Headers
- Series :
- TW
- Stack Height :
- 4.95 mm
- Termination Style :
- Solder
Description
Board to Board & Mezzanine Connectors Flexible Board Stacking Header, 2.00mm Pitch
Price & Procurement
Associated Product
-
-
-
-
-
-
-
Amphenol FCIAutomotive Connectors Minitek MicroSpaceXS,1.27mm Crimp-to-Wire Connector Platform, Wire to Board Header, 3 Position., STG, Top Latch, Gold, WaterProof
-
-
-
You May Also Be Interested In
MSAP-05BFFM-SL8B01
T4151210002-003
MSAP-04BFFM-SL8D02
8-04PMMS-SH7AA0
CB-03RFFS-RC8C10
MSAS-03PFFC-SF8BA5
8A-02AMMM-SL7A04
MSAP-04BFFM-SR8D02
M12A-03BFFM-SR8D02
M12T-04PMMS-SH8C50
8A-06AMMM-SR7A01
MSAS-04PMMC-SF8BA0
MSDS-04PMMC-SF8BA0
CB-02RFFS-RS8D15
CB-02RFFS-RS8C15
MSAP-05BMMM-SL8A02
MSAP-05BFFM-SR8B01
MSBP-05BMMM-SL8A02
MSAP-03BMMM-SL8A03
MSAP-03BMMM-SL8D03