Product overview
- Part Number
- CLP-113-02-G-D-PA
- Manufacturer
- Samtec
- Product Category
- Board to Board & Mezzanine Connectors
- Description
- Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 0.050 Pitch
Documents & Media
- Datasheets
- CLP-113-02-G-D-PA
Product Attributes
- Contact Material :
- Phosphor Bronze
- Contact Plating :
- Gold
- Current Rating :
- 3.4 A
- Housing Material :
- Liquid Crystal Polymer (LCP)
- Maximum Data Rate :
- 8 Gbps
- Maximum Operating Temperature :
- + 125 C
- Minimum Operating Temperature :
- - 55 C
- Mounting Angle :
- Vertical
- Number of Positions :
- 26 Position
- Number of Rows :
- 2 Row
- Packaging :
- Tray
- Pitch :
- 1.27 mm
- Product :
- Sockets
- Series :
- CLP
- Termination Style :
- Solder Pin
- Voltage Rating :
- 280 VAC, 395 VDC
Description
Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 0.050 Pitch
Price & Procurement
Associated Product
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Amphenol FCIAutomotive Connectors Minitek MicroSpaceXS,1.27mm Crimp-to-Wire Connector Platform, Wire to Board Header, 3 Position., STG, Top Latch, Gold, WaterProof
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