Product overview
- Part Number
- CLP-112-02-G-D-PA
- Manufacturer
- Samtec
- Product Category
- Board to Board & Mezzanine Connectors
- Description
- Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 0.050 Pitch
Documents & Media
- Datasheets
- CLP-112-02-G-D-PA
Product Attributes
- Contact Material :
- Phosphor Bronze
- Contact Plating :
- Gold
- Current Rating :
- 3.4 A
- Housing Material :
- Liquid Crystal Polymer (LCP)
- Maximum Data Rate :
- 8 Gbps
- Maximum Operating Temperature :
- + 125 C
- Minimum Operating Temperature :
- - 55 C
- Mounting Angle :
- Vertical
- Number of Positions :
- 24 Position
- Number of Rows :
- 2 Row
- Packaging :
- Tray
- Pitch :
- 1.27 mm
- Product :
- Sockets
- Series :
- CLP
- Termination Style :
- Solder Pin
- Voltage Rating :
- 280 VAC, 395 VDC
Description
Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 0.050 Pitch
Price & Procurement
Associated Product
-
-
-
-
-
-
-
Amphenol FCIAutomotive Connectors Minitek MicroSpaceXS,1.27mm Crimp-to-Wire Connector Platform, Wire to Board Header, 3 Position., STG, Top Latch, Gold, WaterProof
-
-
-
You May Also Be Interested In
MFR-25FTE52-4K7
MFR-25FTE52-2K4
MFR-25FRF52-8K2
MFR-25FRF52-82K
MFR-25FTE52-300R
MFR-25FBF52-1K1
MFR-25FTE52-200R
MFR-25FTE52-75R
MFR3-1K0FC
MFR-25FTE52-27K
MFR-25FBF52-24K9
MFR-25FRF52-7K5
MFR-25FBF52-2K7
MFR3-100KFC
MFR-25FTE52-39K
MFR-25FRF52-470R
MFR3-10KFC
MFR-25FTE52-100K
MFR-25FTF52-150R
MF0207FTE52-150R